semiconductor
packaging news
Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
Surfx-Technologies
Press Release
December 10, 2024  -  Click the title to read the full press release.

Florida Semiconductor Institute and AmSkills Partner to Boost Florida's Semiconductor Workforce



As the semiconductor industry rapidly evolves in Florida, continuous skill and knowledge enhancement is essential for the workforce. Fortunately, a new partnership between ...

The Florida Semiconductor Institute
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Sponsor
XYZTEC

Chiplets and Advanced Packaging
Chiplets represent a transformative approach to semiconductor design. This paper underscores the critical relationship between chiplets and material testing. Download now.
XYZTEC
Ormet-TLPS