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Advanced-Component-Labs

"Build Up" I/C Packages -- USA Fabrication
High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more.
Advanced Component Labs, Inc.
CyberOptics
Press Release
December 4, 2024  -  Click the title to read the full press release.

Hitachi High-Tech Launches DCR Etch System 9060 Series



Hitachi High-Tech Corporation announced the launch of its DCR Etch System 9060Series. This system, which leverages Hitachi High-Tech's plasma etching technology ...

Hitachi High-Tech Corporation
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Brewer-Science

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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