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A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech

Press Release

November 26, 2024 - Click the title to read the full press release.

HPC customer engages Sondrel for multi-million dollar, high end chip design

Sondrel has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer. Ollie Jones ...

Sondrel

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Sponsor

TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International