February 18, 2026
Indium Engineer Examines Key Factors Impacting Improvements in Metal TIMs at TestConX 2026
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2026, taking place March 1-4 in Mesa, Arizona. The session, ...
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January 20, 2026
Indium Corporation to Reinforce Its Leadership in Ag and Cu Pressure Sinter Solutions at NEPCON Japan 2026
Indium Corporation® will feature its highly versatile InFORCE® series of pressure sinter paste at NEPCON Japan 2026, January 21-23, in Tokyo. The company will showcase ...
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January 14, 2026
Indium Corporation Brings Precision Au-Based Die-Attach Preforms to SPIE Photonics West
Indium Corporation® will showcase its high-reliability, Au-based precision die-attach preforms for critical laser applications at SPIE Photonics West, January 20-22, in San Francisco ...
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December 3, 2025
Indium Expert to Tackle Reliability Challenges in AI at EPTC 2025
Indium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). ...
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December 1, 2025
Indium Corporation to Share Expertise on Thermal Interface Materials at Upcoming INEMI Webinar
A technical presentation on thermal interface materials (TIMs) will be featured at an upcoming webinar organized by the International Electronics Manufacturing Initiative ...
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November 17, 2025
Indium Corporation to Feature Thermal Materials Solutions for High-Performance Computing at SC25
As one of the leading providers of high-performance thermal materials solutions, Indium Corporation® is proud to feature its lineup of metal thermal interface materials and ...
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November 12, 2025
Indium Corporation is Electrifying the Future with Advanced Materials Solutions at Productronica
As one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium ...
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October 23, 2025
Indium Corporation Expert to Present on Advancing Thermal Performance at TestConX China
Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus ...
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October 22, 2025
Indium Introduces 2026 DIY Internship Program to Empower the Next Gen of Industry Leaders
Indium Corporation is proud to announce its 2026 Internship Program, introducing a do-it-yourself (DIY) format that allows students to shape a personalized professional ...
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October 15, 2025
Indium Corporation to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTAI
As one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA ...
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