February 5, 2026
Siemens acquires Canopus AI to bring AI-based metrology to semiconductor manufacturing
Siemens announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve ...
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January 8, 2026
Siemens unveils technologies to accelerate the industrial AI revolution at CES 2026
At CES 2026, Siemens' keynote marked a new era of technology for industry and infrastructure, showcasing how customers and partners are harnessing artificial intelligence ...
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January 7, 2026
Siemens and NVIDIA Expand Partnership to Build the Industrial AI Operating System
Siemens and NVIDIA announced a significant expansion of their strategic partnership to bring artificial intelligence into the real world. Together, the companies aim to develop ...
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December 19, 2025
Toshiba to accelerate semiconductor design innovation with Siemens' EDA software
Siemens has introduced Siemens’ electronic design automation (EDA) software to enhance its power devices and analog semiconductor development capabilities. With this ...
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December 18, 2025
Toshiba to accelerate semiconductor design innovation with Siemens' EDA software
Siemens announced that Toshiba Electronic Devices & Storage Corporation has introduced Siemens' electronic design automation (EDA) software to enhance its power ...
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December 16, 2025
Siemens and GlobalFoundries collaborate to deploy AI-driven manufacturing
Siemens and GlobalFoundries (GF) have entered a new strategic collaboration to leverage each company’s complementary AI-based capabilities to enhance performance ...
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December 9, 2025
Certus Semiconductor adopts AI-powered Solido
Siemens announced that Certus Semiconductor has adopted Solido™ software for custom integrated circuit (IC) design to accelerate development of Input/output (IO) and ...
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November 18, 2025
SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin technology
Siemens announced that SAICEC has begun building complex digital twins of automotive architectures based on Siemens’ PAVE360™ software, facilitating comprehensive ...
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October 6, 2025
Siemens and ASE collaborate on workflows for ASE's VIPack advanced packaging platform
Siemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), to develop 3Dblox-based workflows for the ...
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October 3, 2025
Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
At the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC ...
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