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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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| Press Release |
October 25, 2024 - Click the title to read the full press release.
SEMIExpo Vietnam 2024 is officially announced today as Vietnam positions itself as a dynamic new player in the global semiconductor industry. Set to highlight this transformation, ...
SEMI
June 17, 2026
3D & Systems Summit
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June 8, 2026
SEMI Reports Global Semiconductor Equipment Billings Increased 14% Year-Over-Year in Q1 2026
SEMI announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report that global semiconductor equipment billings increased 14% year-over-year ...
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May 28, 2026
SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends
SEMI announced the availability of a new industry research report focused on the glass core substrate market and trends, produced in collaboration with Global Net Corp. (GNC). ...
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May 21, 2026
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
FlexTech issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive ...
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May 20, 2026
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
FlexTech issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive ...
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May 18, 2026
SEMI and 23 Member Companies Urge U.S. Congress to Extend Advanced Manufacturing Investment Credit
SEMI and 23 member companies on the SEMI Tax Policy Committee, issued a letter to the U.S. Congress urging immediate passage of a multi-year extension of the Advanced ...
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May 14, 2026
Global Semiconductor Materials Market Revenue Reaches Record $73.2 Billion in 2025, SEMI Reports
Global semiconductor materials market revenue increased 6.8% year-over-year to $73.2 billion in 2025, SEMI, reported today in its Materials Market Data Subscription (MMDS). ...
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May 12, 2026
SEMI 3D & Systems Summit to Advance Heterogeneous Systems Integration
Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany. ...
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May 7, 2026
SEMICON Southeast Asia 2026 Officially Launches in Kuala Lumpur
SEMICON Southeast Asia (SEMICON SEA) 2026 was officially launched today at the Malaysia International Trade and Exhibition Centre (MITEC), bringing together policymakers, ...
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May 4, 2026
SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
The SEMI Silicon Manufacturers Group (SMG) reported that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 ...
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How to Cold Bump Pull?
Learn how to perform an optimal Cold Bump Pull test on solder balls using tweezers. This guide covers test method settings and failures modes for CBP all types of bump testing.
xyztec
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