| Sponsor |
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Die-Module Attach for High Power Devices
High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding.
AI Technology, Inc.
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| Press Release |
August 30, 2024 - Click the title to read the full press release.
As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and assembly ...
Indium Corporation
October 23, 2025
Indium Corporation Expert to Present on Advancing Thermal Performance at TestConX China
Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus ...
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October 22, 2025
Indium Introduces 2026 DIY Internship Program to Empower the Next Gen of Industry Leaders
Indium Corporation is proud to announce its 2026 Internship Program, introducing a do-it-yourself (DIY) format that allows students to shape a personalized professional ...
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October 15, 2025
Indium Corporation to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTAI
As one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA ...
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October 7, 2025
Indium Corporation Commemorates 30th Anniversary of Asia-Pacific Hub in Singapore
Indium Corporation celebrates 30 years of service at its Asia-Pacific Operations (APO) facility. Located in Singapore, the facility serves customers worldwide, particularly ...
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October 2, 2025
Indium Corporation Features Next-Generation Materials for Semiconductor Assembly at IMAPS
Indium Corporation will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics ...
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October 1, 2025
Indium Corporation Expert to Present on Innovative Thermal Management Solution at IMAPS Thermal Conference
Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on a new liquid metal containment method for thermal ...
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September 30, 2025
Indium Corporation Experts to Present on Thermal Interface Materials at IMAPS Microelectronics Symposium
Indium Corporation experts will deliver technical presentations on thermal interface materials (TIMs) at the International Symposium on Microelectronics, organized by the ...
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September 2, 2025
Indium Corporation Promotes Huang to Senior Manager, Marketing Communications
With its commitment to innovation and growth through employee development, Indium Corporation announces the promotion of Jingya Huang to Senior Manager, Marketing ...
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August 29, 2025
Indium Corporation Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics
Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) ...
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August 22, 2025
Indium Corporation to Showcase Innovative Materials Enabling AI Technology at SEMICON Taiwan
Indium Corporation® will showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs) at SEMICON Taiwan, to be held ...
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| Sponsor |
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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