semiconductor
packaging news
Sponsor
Akrometrix

Effect of Package Warpage and Composite CT on Failure Modes
Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data.
Akrometrix
Tresky
Press Release
August 26, 2024  -  Click the title to read the full press release.

DataPhysics Instruments Launches the Portable Contact Angle Goniometer PCA 200



DataPhysics Instruments has launched a world's first: the PCA 200 Portable Contact Angle Goniometer - a handheld, fully self-contained device for determining surface cleanliness ...

DataPhysics Instruments
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Pac-Tech

SB²®-Jet: Your Soldering Game-Changer
SB²®-Jet offers high-precision solder ball jetting technology, handling ball diameters from 40µ-760µm. Perfect for flip chip, PCB, reballing, BGA, CSP applications.
PacTech
Brewer-Science