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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
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| Press Release |
July 17, 2024 - Click the title to read the full press release.
AEM announced today the launch of a new burn-in capability for its high-parallel test platform, AMPS. The new variant, named AMPS-BI, is a high-power, high-throughput ...
AEM
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Proven SiPaste® for Ultrafine Printing
Boost SPI yields with SiPaste® C201HF. Formulated for fine feature printing, it combines superior non-wet open performance with excellent stencil print transfer efficiency.
Indium Corporation
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