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Plasma Processing Wafers and Dies
The STW-10 automated plasma system optimizes front-end semiconductor processing, activating silicon surfaces for hybrid bonding. It handles 300 mm wafers or dies on tape frames.
Surfx Technologies
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| Press Release |
July 10, 2024 - Click the title to read the full press release.
Junkosha has launched their latest innovation for the global semiconductor manufacturing industry at this year’s SEMICON West exhibition. Junkosha High Barrier PFA Tubing ...
Junkosha USA Inc.
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Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
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Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
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