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Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
SEMI
Press Release
July 10, 2024  -  Click the title to read the full press release.

Resonac Announces New US-JOINT Consortium



Resonac Corporation unveiled a new consortium of ten partners, called "US-JOINT," for its semiconductor back-end process R&D in Silicon Valley. The ten American and ...

Resonac Corporation
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Sponsor
Camtek-USA-Inc

Multi-Sensor Metrology
Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for packaging applications.
Camtek
SEIKA-America