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Hermetic Package Seam Seal with HDHS® Technology
Brings a new level of precision and automation for hi-rel microelectronic package encapsulation, increasing seal yields to 99.99% and lowering operation costs for Aerospace, Military, Microwave, Photonics and MEMS.
MicroCircuit Laboratories, LLC
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| Press Release |
June 11, 2024 - Click the title to read the full press release.
As automotive applications, 5G and 6G, smart devices and many others require ever more compact and powerful components, advanced packaging becomes one ...
ASMPT
March 12, 2026
ASMPT at OFC 2026 Los Angeles
ASMPT will exhibit at the Optical Fiber Communication Conference and Exhibition (OFC) from March 17–19, 2026, at Booth #221 at the Los Angeles Convention Center. ...
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December 12, 2025
ASMPT presents optimized Odd Shaped Component (OSC) Package
With the optimized SIPLACE OSC Package, technology and market leader ASMPT SMT Solutions is strengthening the competitiveness of modern electronics manufacturing. ...
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December 9, 2025
ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market
ASMPT announced it had won new orders for 19 Chip-to-Substrate (C2S) TCB tools from a major OSAT partner of the leading foundry serving the AI chip market. ASMPT ...
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September 29, 2025
ASMPT at SEMICON West 2025
ASMPT will participate in SEMICON West 2025. Under the theme "Empower the Intelligence Revolution," the company will showcase its advanced packaging portfolio on October 7–9 ...
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September 15, 2025
ASMPT Introduces ALSI LASER1206 - Fully Automatic Laser Dicing and Grooving
ASMPT Semiconductor Solutions launches the ALSI LASER1206, its latest system for bare wafer handling and separation under Class 1000 cleanroom conditions, at SEMICON ...
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September 10, 2025
ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
ASMPT announced the appointment of Mr. Gordon Lam as Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions). Gordon joined ASMPT in August with ...
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September 5, 2025
ASMPT Joins "JOINT3" Consortium to Develop Next-Gen Semiconductor Packaging
ASMPT Limited (ASMPT) announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging. JOINT3 is a co-creation evaluation ...
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August 27, 2025
ASMPT exhibits at SEMICON Taiwan
ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12 2025. The theme of the presentation at Booth L0716 at Level 4, TaiNEX 1 in Taipei is: "Empower the ...
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August 8, 2025
ASMPT introduces MEGA multi-chip bonding platform
ASMPT SEMI sets the standard in precision and speed with its new MEGA multi-chip bonding platform. The new device family is characterized by high flexibility, a modular ...
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July 14, 2025
ASMPT introduces AERO PRO high-performance wire bonder
ASMPT introduces its latest high-performance wire bonder: the AERO PRO. Developed for high-density semiconductor designs, the AERO PRO delivers the highest bonding ...
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| Sponsor |
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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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