December 8, 2025
Presentation Highlights High-Temp-Stable Temporary Bonding and IR Laser Debonding with Si Carriers
Brewer Science, in collaboration with EV Group (EVG) and Fraunhofer IZM ASSID, will co-present groundbreaking research on ultrathin wafer handling at WaferBond ’25 ...
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October 2, 2025
EV Group Highlights Hybrid Bonding, Lithography and More at SEMICON West
EV Group announced that it is highlighting the latest developments in hybrid bonding, maskless lithography, metrology and nanometer-precision layer transfer technology ...
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September 10, 2025
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
EV Group (EVG) unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers ...
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September 4, 2025
EV Group Promotes Cindy Lee to GM of Taiwan Subsidiary
EV Group (EVG) announced the promotion of Cindy (Yu-Ying) Lee to general manager of EV Group Taiwan Ltd., EVG's fully owned subsidiary in Taiwan. Lee assumes this leadership ...
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June 30, 2025
EV Group Tops Customer Rankings in TechInsights 2025 Global Semiconductor Industry Customer Satisfaction Survey
EV Group (EVG) announced that it has once again topped the rankings in the 2025 TechInsights Semiconductor Supplier Awards. EVG was voted by customers as one of the Top 10 ...
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May 29, 2025
EV Group Brings Digital Lithography to Heterogeneous Integration HVM
EV Group (EVG) introduced the LITHOSCALE® XT maskless exposure (MLE™) system, the industry's first true high-throughput/high-resolution ...
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May 21, 2025
EV Group Forms Subsidiary in Singapore to Strengthen Local Customer Support
EV Group (EVG) announced that it has formed a fully owned subsidiary in Singapore. Called EV Group E. Thallner Singapore Pte. Ltd., the new subsidiary will be charged with ...
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May 15, 2025
EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for HI to be Highlighted at ECTC
EV Group (EVG) announced that new developments in heterogeneous integration enabled by its wafer-to-wafer and die-to-wafer hybrid bonding, maskless lithography ...
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March 20, 2025
EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI®
EV Group (EVG) unveiled the next-generation version of its GEMINI® automated production wafer bonding system for 300-mm wafers. Based on the global industry standard ...
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February 19, 2025
EV Group Highlights Temporary Bonding/Debonding for HBM, 3D DRAM at SEMICON
EV Group (EVG) announced that it is highlighting its industry-leading IR LayerRelease™ temporary bonding and debonding (TB/DB) solution, as well other wafer bonding ...
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