June 2, 2026
Imec and EV Group demonstrate advances in wafer-to-wafer hybrid bonding
At the 2026 IEEE Electronic Components and Technology Conference (ECTC), imec, a world-leading research and innovation hub in advanced semiconductor technologies ...
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May 20, 2026
EV Group Highlights Technologies for Heterogeneous Integration at ECTC 2026
EV Group (EVG) announced that it will showcase its latest solutions for heterogeneous integration and advanced packaging at the 2026 IEEE Electronic Components and Technology ...
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May 11, 2026
Xanadu and EV Group partner to build industrial-scale photonic quantum hardware
Xanadu Quantum Technologies Ltd. and EV Group announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate ...
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April 22, 2026
CEZAMAT Boosts Advanced Photonics R&D with UV Nanoimprint System from EV Group
CEZAMAT and EV Group announced that CEZAMAT's research infrastructure has been enhanced with the installation of a new EVG®6200 NT SmartNIL® UV nanoimprint ...
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February 19, 2026
EV Group Unveils Next-Gen EVG®120 Resist Processing System for High-Volume Manufacturing
EV Group (EVG) unveiled the next-generation EVG®120 automated resist processing system — a major update to one of the company’s leading coater/developer platforms. ...
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February 5, 2026
EV Group Highlights Hybrid and Fusion Bonding at SEMICON Korea 2026
EV Group (EVG) announced that it will showcase its latest solutions for heterogeneous integration, advanced packaging and fine-pitch wafer probe card manufacturing at ...
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December 8, 2025
Presentation Highlights High-Temp-Stable Temporary Bonding and IR Laser Debonding with Si Carriers
Brewer Science, in collaboration with EV Group (EVG) and Fraunhofer IZM ASSID, will co-present groundbreaking research on ultrathin wafer handling at WaferBond ’25 ...
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October 2, 2025
EV Group Highlights Hybrid Bonding, Lithography and More at SEMICON West
EV Group announced that it is highlighting the latest developments in hybrid bonding, maskless lithography, metrology and nanometer-precision layer transfer technology ...
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September 10, 2025
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
EV Group (EVG) unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers ...
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September 4, 2025
EV Group Promotes Cindy Lee to GM of Taiwan Subsidiary
EV Group (EVG) announced the promotion of Cindy (Yu-Ying) Lee to general manager of EV Group Taiwan Ltd., EVG's fully owned subsidiary in Taiwan. Lee assumes this leadership ...
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