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Ironwood-Electronics

How to Select RF Test Socket
The classic function of a socket is to provide a replaceable connection mechanism from the IC (Integrated Circuit) to the circuit board with minimal signal loss.
Ironwood Electronics
Circuit-Technology-Center
Press Release
March 11, 2024  -  Click the title to read the full press release.

nepes corporation expands IC packaging capabilities for the 3DIC era with advanced design flows from Siemens



Siemens Digital Industries Software announced that South Korea-based nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test (OSAT) services ...

Siemens Digital Industries Software
October 6, 2025
Siemens and ASE collaborate on workflows for ASE's VIPack advanced packaging platform
Siemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), to develop 3Dblox-based workflows for the ...
October 3, 2025
Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
At the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC ...
September 24, 2025
Siemens accelerates complex semiconductor design and test with Tessent IJTAG Pro
Siemens Digital Industries Software announced today Tessent™ IJTAG Pro software, which will transform IJTAG (IEEE 1687) input/output by enabling parallel operations ...
July 25, 2025
Siemens and UMC collaborate to advance EM/IR drop analysis with mPower technology
Siemens Digital Industries Software announced that it has collaborated with United Microelectronics Corporation (UMC) to implement Siemens' mPower™ software ...
July 15, 2025
Siemens collaborates with SK keyfoundry to launch 130nm automotive power semiconductor Calibre PERC PD
Siemens Digital Industries Software announced that SK keyfoundry, in collaboration with Korea Siemens EDA, has launched a 130nm automotive PDK (Process Design Kit) ...
May 23, 2025
Siemens to bring advanced timing constraint capabilities to EDA design flow
Siemens Digital Industries Software announced that it has entered into an agreement to acquire Excellicon. This will bring Excellicon's best-in-class software for the development ...
May 2, 2025
Siemens and Intel Foundry advance collaboration
Siemens Digital Industries Software announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference ...
April 28, 2025
Siemens and TSMC extend collaboration to drive semiconductor design innovation
Siemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration ...
November 21, 2024
Infineon and Siemens collaborate to bring AURIX TC4x to next generation software-defined vehicles
Siemens Digital Industries Software announced today its ongoing collaboration with Infineon to combine Siemens’ embedded automotive software platform, based on ...
November 11, 2024
Siemens extends Veloce hardware-assisted verification and validation with new Innexis shift-left software
Siemens Digital Industries Software announced today the Innexis product suite, a complement to its industry leading Veloce™ hardware-assisted verification and validation ...
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Brewer-Science

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
Ormet-TLPS