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High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
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| Press Release |
March 6, 2024 - Click the title to read the full press release.
Semidynamics has released its new tool called 'Configurator' that puts the power of Semidynamics' full customisation of a RISC-V processor core in the hands of the customer. ...
Semidynamics
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