Press Release
February 12, 2024  -  Click the title to read the full press release.

Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity



Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity ...

Master Bond
February 12, 2024
Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity
Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity ...
January 12, 2024
Food Grade Epoxy Features Enhanced Chemical Resistance
EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. ...
December 4, 2023
Flexible, Thixotropic, One Component Dual Cure Epoxy
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds ...
November 3, 2023
One Part RTV Silicone Passes Non-Cytotoxicity Standards
Designed for medical device manufacturing, MasterSil 711Med passes ISO 10993-5 testing. It is a one part, flowable, room temperature vulcanizing (RTV) silicone which ...
October 17, 2023
Toughened, One Component Epoxy Features High Glass Transition Temperature
Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications. It is a true one component ...
September 25, 2023
Electrically Insulative Two Component Epoxy Features High Elongation
Master Bond EP21LVFL combines good flexibility with a solid strength profile. It is curable at room temperature with a long working life ...
August 2, 2023
Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications
Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive ...
July 24, 2023
One Part, Toughened Epoxy for Dam-and-Fill Encapsulation
Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated ...
May 3, 2023
Thixotropic Epoxy Features Low Coefficient of Thermal Expansion
Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE) high glass transition temperature (Tg) ...
April 24, 2023
Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements
Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This ...
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