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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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| Press Release |
January 12, 2024 - Click the title to read the full press release.
Accuron Technologies (Accuron) announces the successful acquisition of Recif Technologies (Recif), a France-based company specialising in the design, manufacture, and ...
Accuron Technologies
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DIE Stacking on a Small Area
Assembly process where chips are stacked on top of one another on a substrate. This vertical integration allows a compact arrangement of different circuits with different dimensions on a small area.
Tresky Automation
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