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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
December 15, 2023 - Click the title to read the full press release.
itachi High-Tech Corporation announced the launch of its GT2000 high-precision electron beam metrology system. GT2000 uses Hitachi High-Tech's technology and expertise ...
Hitachi High-Tech Corporation
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Current Characterization of Various Cu RDL Designs In WLP
This study evaluates copper redistribution layer fusing currents in WLP through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
Amkor Technology
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