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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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| Press Release |
December 1, 2023 - Click the title to read the full press release.
To encourage research, development, and innovation in semiconductor manufacturing, the Commerce Department’s U.S. Patent and Trademark Office (USPTO) is announcing ...
USPTO
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Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science
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