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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Press Release

November 22, 2023 - Click the title to read the full press release.

KoolMicro Inc. developed First 2,000 W/cm2 Cooling Technology for High Heat Generation Chips

KoolMicro Inc. has successfully developed the world's first technology that can cool down heat at the level of 2,000 W/cm2. This innovative cooling technology is expected ...

KoolMicro Inc.

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH