| Press Release |
November 22, 2023 - Click the title to read the full press release.
KoolMicro Inc. has successfully developed the world's first technology that can cool down heat at the level of 2,000 W/cm2. This innovative cooling technology is expected ...
KoolMicro Inc.
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1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
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