| Sponsor |
|
Plasma Processing Wafers and Dies
The STW-10 automated plasma system optimizes front-end semiconductor processing, activating silicon surfaces for hybrid bonding. It handles 300 mm wafers or dies on tape frames.
Surfx Technologies
|
|
| Press Release |
November 22, 2023 - Click the title to read the full press release.
The initial optimism surrounding microLED technology in 2017, with expectations of commercialization by 2020-2021, has given way to a more extended timeline. Mean ...
YOLE Group
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
