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Packaging Solutions for Unique Markets
The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. MLF/QFN packaging solutions represent a >111B-unit market across five unique markets.
Amkor Technology, Inc.
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| Press Release |
November 22, 2023 - Click the title to read the full press release.
The initial optimism surrounding microLED technology in 2017, with expectations of commercialization by 2020-2021, has given way to a more extended timeline. Mean ...
YOLE Group
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94GHz Elastomer Socket BGA1440
Test a 75 watt BGA device with high performance elastomer using a simple swivel lid mechanism. Elastomer connects each signal with -1dB insertion loss
Pic: C24548.jpg
Ironwood Electronics
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