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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Press Release

August 7, 2023 - Click the title to read the full press release.

KemLab Inc. Offers Game-Changing Negative Tone Epoxy Photoresist Outperforming SU-8

KemLab Inc. offers HARE SQ™, a state-of-the-art negative tone epoxy photoresist designed to revolutionize the world of polymeric MEMS, microfluidics, micromachining ...

KemLab Inc.

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Sponsor

Multi-Sensor Metrology
Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for packaging applications.
Camtek