semiconductor
packaging news
Sponsor
Pac-Tech

A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech
Master-Bond
Press Release
August 7, 2023  -  Click the title to read the full press release.

KemLab Inc. Offers Game-Changing Negative Tone Epoxy Photoresist Outperforming SU-8



KemLab Inc. offers HARE SQ™, a state-of-the-art negative tone epoxy photoresist designed to revolutionize the world of polymeric MEMS, microfluidics, micromachining ...

KemLab Inc.
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
BTU-International

TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International
QPT