| Press Release - Brewer Science, Inc. |
May 26, 2023 - Click the title to read the full press release.
Brewer Science, Inc. is presenting and exhibiting at Electronic Components and Technology Conference (ECTC) May 30th through June 2nd. Dr. Koen Kennes from imec is ...
Brewer Science, Inc.
September 1, 2023
Brewer Science unveils advanced packaging solutions at SEMICON Taiwan 2023
Brewer Science, Inc., will present new developments in temporary and permanent bonding material technologies for advanced packaging this week at Asia's two premier ...
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August 18, 2023
Brewer Science Expands Vichy Manufacturing Center to Support Semiconductor Growth
Brewer Science is thrilled to announce the expansion of its Vichy Manufacturing Center with a ribbon-cutting ceremony. This momentous occasion marks a significant step forward ...
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July 24, 2023
Brewer Science Presents Printed and Flexible CO2 Sensors at Carbon 2023 Conference
Brewer Science, Inc. will present Printed and Flexible CO2 Sensors Prepared via Different Carbon Materials: A Comparison Study ...
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July 13, 2023
Photosensitive Permanent Bonding Material Designed for Polymer/Metal Hybrid Bonding Applications
In this paper, a novel negative-tone, photosensitive, polymeric bonding material is proposed that can be used as a dielectric enabling polymer/metal hybrid bonding.
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July 6, 2023
Brewer Science Earns Intel's 2023 EPIC Distinguished Supplier Award
Brewer Science is proud to announce that it has earned Intel's EPIC Distinguished Supplier Award. Through its dedication to Excellence ...
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June 27, 2023
Brewer Science's High-Temp-Stable, Gapfilling Planarizing Material
Brewer Science, Inc. is thrilled to announce the latest breakthrough in high-temperature gapfilling materials ...
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May 26, 2023
Imec and Brewer Science present process solutions for CVD oxide deposition processes at ECTC
Brewer Science, Inc. is presenting and exhibiting at Electronic Components and Technology Conference (ECTC) May 30th through June 2nd. Dr. Koen Kennes from imec is ...
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May 3, 2023
Brewer Science and PulseForge Bring Photonic Debonding to Semiconductor Advanced Packaging at Scale
Brewer Science, Inc. and PulseForge, Inc. bring substantial cost savings, increased throughput, and other benefits with photonic debonding to semiconductor advanced ...
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April 27, 2023
Brewer Science and PulseForge Bring Photonic Debonding to Semiconductor Advanced Packaging at Scale
Brewer Science, Inc. and PulseForge, Inc. bring substantial cost savings, increased throughput, and other benefits with photonic debonding to semiconductor advanced packaging. ...
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April 12, 2023
Brewer Science presents New Developments in Underlayers at Critical Materials Conference
Brewer Science, Inc.will present New Developments in Underlayers and Their Role in Advancing EUV Lithography at Critical Materials Council (CMC) Conference. Demand ...
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