| Press Release |
September 13, 2022 - Click the title to read the full press release.
Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated ...
Master Bond
March 31, 2026
Non-Frozen, Silver Filled Epoxy Features High Thermal and Electrical Conductivity
Master Bond EP6STC-80 is a one component, non-frozen, silver filled epoxy engineered for bonding, sealing, and coating applications requiring exceptional thermal and electrical ...
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February 19, 2026
Dual Cure Medical Adhesive Features High Tg and Autoclave Resistance
Master Bond UV26DCMed is a one component, dual cure adhesive system designed for medical device assembly. It is specifically engineered for reusable devices that ...
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January 19, 2026
Electrically Insulating Epoxy Features Ultra-High Thermal Conductivity
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring ...
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January 5, 2026
Structural One Part Epoxy for High-Performance Bonding Applications
Master Bond Supreme 10HTLV is a one part, non-frozen, heat cured epoxy formulated for demanding structural bonding applications. This toughened system features a moderately ...
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November 24, 2025
One Part 300°C Rated Silicone Passes Non-Cytotoxicity Standards
MasterSil 800Med is a one component, moisture curing silicone specifically designed for medical device manufacturing. It passes ISO 10993-5 testing for non-cytotoxicity, confirming ...
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September 24, 2025
Nanosilica Filled, Dual Curable Adhesive Offers Rapid Fixturing with LED Light
Master Bond LED422DC90 is a one component, nanosilica filled dual cure adhesive system engineered for high-speed fixturing and bonding of opaque substrates. This ...
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May 22, 2025
One Part Silver Filled Electrically Conductive Epoxy Passes ISO 10993-5 Standard
Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room ...
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April 29, 2025
Toughened, UV Curable Adhesive Features Optical Clarity
Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system. Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003 inch, ...
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March 25, 2025
Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically ...
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February 26, 2025
Medical Grade, Dual Curable Adhesive Offers Rapid Fixturing with LED Light
Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without ...
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| Sponsor |
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1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
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