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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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| Press Release |
September 17, 2021 - Click the title to read the full press release.
Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled "DIE PLACEMENT HEAD WITH TURRET" and numbered ...
Mycronic
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DIE Stacking on a Small Area
Assembly process where chips are stacked on top of one another on a substrate. This vertical integration allows a compact arrangement of different circuits with different dimensions on a small area.
Tresky Automation
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