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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
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| Press Release |
December 14, 2020 - Click the title to read the full press release.
SUSS MicroTec announces the launch of its latest generation mask aligner, the MA8 Gen5. The new semi-automated tool is specifically aimed at imprint lithography, a key enabling ...
SUSS MicroTec
May 13, 2024
SUSS MicroTec presents world's first hybrid bonding all-rounder XBC300 Gen2 D2W/W2W
SUSS MicroTec SE presents a world novelty: the first hybrid bonding all-rounder. The integrated platform XBC300 Gen2 D2W/W2W covers the complete range of current ...
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March 6, 2024
Heraeus Printed Electronics and SUSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing
Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic ...
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November 21, 2023
SUSS MicroTec's temporary bonding solutions enable rapid expansion of AI applications
Writing texts, creating images – anyone can do this since the advent of generative Artificial Intelligence (AI) such as ChatGPT, Google Bard or DALL-E. Not surprisingly, ...
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July 20, 2023
SUSS MicroTec Introduces New Coating/ Developing Platform ACS200 Gen3 TE at SEMICON West
SÜSS MicroTec SE launches the throughput-maximizing coating/developing platform ACS200 Gen3 TE at SEMICON West. Based on the ...
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November 21, 2022
SUSS MicroTec Introduces 300 mm Imprint Platform at Semicon Europa
SUSS MicroTec SE extends its imprint technology to 300 mm wafers and launches its new mask aligner MA12 Gen3 at Semicon Europa. The addition to the company’s product ...
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November 15, 2022
SUSS MicroTec Tools Exclusively Enable Low -Temperature Impulse Current Bonding
SUSS MicroTec SE paves the way for a novel low-temperature field-assisted bonding technology called Impulse Current Bonding. The technology which has been developed ...
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November 2, 2021
SUSS MicroOptics wins the Swiss Manufacturing Award 2021
SUSS MicroOptics SA, part of technology company SUSS MicroTec SE, has received the 2021 "Swiss Manufacturing Award", in recognition of its outstanding contribution to the ...
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September 8, 2021
Hybrid bonding partnership SET-SUSS MicroTec
SUSS MicroTec and SET signed a joint development agreement to develop a cluster, including several modules such as surface preparation, cleaning, bonding and metrology. ...
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September 7, 2021
SUSS MicroTec and SET to Develop a Combined Equipment Solution for 3D Chip Integration
SUSS MicroTec announces a joint development agreement (JDA) with SET, a leading supplier of high precision flip-chip bonders. The main focus of the JDA is the development ...
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January 4, 2021
Full Wafer Double Sided Monolithic Lens Fabrication
In this paper, we discuss the capability of SUSS UV-imprint lithography together with an optically tailored, UV-curable epoxy resin from DELO to manufacture double-sided ...
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