Sponsor

High-Reliability BGA Reballing
BGA reballing requires controlled deballing, precise ball placement, proper thermal processing, and rigorous inspection. Circuit Technology Center provides repeatable BGA reballing services.
Circuit Technology Center

Industry Paper

The Future of Flip Chip Bonding: How R-LAB and R-LTC Enable Next-Generation AI and HPC Packaging

This paper examines advanced flip chip bonding technologies—LAB, R-LAB, and R-LTC—for AI and HPC packaging, demonstrating improved interconnect quality, warpage management, scalability, and reliability for next-generation chiplet-based semiconductor systems.

Amkor Technology, Inc.

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Sponsor

How heterogenous packaging benefits from atmospheric argon plasma
Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications.
Surfx Technologies