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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems

Industry Paper

Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation

This study demonstrates an alkaline wet etching solution for aluminum and its alloys, delivering controlled anisotropic etching, improved metal selectivity, photoresist compatibility, and an environmentally sustainable alternative to PAN-based chemistries.

Technic Inc.

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Sponsor

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.