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Are You Getting Component Tinning Right?
Component lead tinning involves more than dipping parts in solder. Learn about robotic hot solder dip processing, gold removal, solder thickness control, and process considerations.
Circuit Technology Center
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| Industry Paper |
Why Metal TIM Warpage Simulations Fail—and How to Fix Them
This study shows why metal TIM warpage simulations often fail when using bulk material properties and demonstrates that rheometer-derived film measurements significantly improve accuracy, reliability, and the optimization of high-performance package designs.
Amkor Technology, Inc.
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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