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Convenient Desktop Plasma System
The PE-100 utilizes a capacitive parallel plate design for the most effective plasma generation available. Our systems offer uniform plasma with a low environmental impact at a great value.
Plasma Etch
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| Industry Paper |
Why Metal TIM Warpage Simulations Fail—and How to Fix Them
This study shows why metal TIM warpage simulations often fail when using bulk material properties and demonstrates that rheometer-derived film measurements significantly improve accuracy, reliability, and the optimization of high-performance package designs.
Amkor Technology, Inc.
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High-Reliability BGA Reballing
BGA reballing requires controlled deballing, precise ball placement, proper thermal processing, and rigorous inspection. Circuit Technology Center provides repeatable BGA reballing services.
Circuit Technology Center
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