semiconductor
packaging news
Sponsor
Circuit Technology Center
Reduce Gold Embrittlement Risk Before Assembly
Excess gold from component terminations can weaken solder joints. Explore how controlled gold removal and robotic hot solder dipping help protect assembly reliability in this technical paper.
Circuit Technology Center
Precision Dispensing Solutions
Industry Paper

Why Metal TIM Warpage Simulations Fail—and How to Fix Them

This study shows why metal TIM warpage simulations often fail when using bulk material properties and demonstrates that rheometer-derived film measurements significantly improve accuracy, reliability, and the optimization of high-performance package designs.
Amkor Technology, Inc.
Complete the form below to download this technical paper.

Your Name


Your Company
Your E-mail


Your Country
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
xyztec
No more cartridge exchanges
The unique Revolving Measurement Unit (RMU) houses up to 6 sensors of any type that enable continuous pull/push and shear testing up to 200 kgf. Learn more.
xyztec