| Industry Paper |
Bond front velocity in lubrication-mediated bonding of flexible substrates
Robust theoretical model explaining bondwave velocity in direct wafer/die bonding and explaining why it accelerates. First model with predictive power to show realistic and observed values.
imec
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ECTC Call for Papers Due October 5
ECTC invites abstracts for its 77th conference. The leading packaging event will showcase 2.5D/3D integration, chiplets, hybrid bonding, panel-level packaging, photonics, glass substrates and advanced materials.
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