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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
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| Industry Paper |
Bond front velocity in lubrication-mediated bonding of flexible substrates
Robust theoretical model explaining bondwave velocity in direct wafer/die bonding and explaining why it accelerates. First model with predictive power to show realistic and observed values.
imec
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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
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