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Sponsor
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Gold Mitigation: What Engineers Need to Know
When gold-plated component surfaces enter the solder joint, reliability can be at risk. This technical paper examines gold removal, robotic hot solder dip processing, testing, and process control.
Circuit Technology Center
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| Industry Paper |
How AI Could Cut Semiconductor Package Design Cycles from Months to Days
This paper explores how AI-powered semiconductor package design tools can accelerate development, reduce errors, optimize performance and sustainability, and enhance engineer productivity, transforming package design cycles from months to days.
Amkor Technology, Inc.
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