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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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| Industry Paper |
5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing
Study examines how EtherCAT-networked automation enables high-speed sorting of increasingly small and fragile semiconductor dies. The equipment combines micron-level motion accuracy, gentle handling, inline testing, flexible packaging formats and production-scale throughput.
Beckhoff Automation LLC
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Sponsor
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Fusion and Hybrid Bonding Experts
EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology.
EV Group
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