Sponsor

Lab Bonder for Microelectronics & Photonics
Tresky's Lab Bonder for advanced packaging provides accuracy of ±0.7 μm for reproducible submicron bonding processes in R&D and emerging applications.
Tresky

Industry Paper

A New Optical Ball Grid Array Package Development for Automotive Optical Sensor

This study develops a robust optical ball grid array package for automotive image sensors, optimizing materials, design, and processes to mitigate thermal stresses, improve reliability, and meet stringent ADAS qualification requirements.

Amkor Technology, Inc.

Complete the form below to download this technical paper.

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology