Sponsor

Fusion and Hybrid Bonding Experts
EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology.
EV Group

Industry Paper

A New Optical Ball Grid Array Package Development for Automotive Optical Sensor

This study develops a robust optical ball grid array package for automotive image sensors, optimizing materials, design, and processes to mitigate thermal stresses, improve reliability, and meet stringent ADAS qualification requirements.

Amkor Technology, Inc.

Complete the form below to download this technical paper.

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology