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Gold Mitigation: What Engineers Need to Know
When gold-plated component surfaces enter the solder joint, reliability can be at risk. This technical paper examines gold removal, robotic hot solder dip processing, testing, and process control.
Circuit Technology Center
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| Industry Paper |
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages.
MacDermid Alpha Electronics Solutions
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S-Connect™: Advanced Bridge Die Solution
Introducing Amkor's new S-Connect™, S-SWIFT™ with an embedded silicon bridge, delivering improved power integrity and signal performance.
Amkor Technology
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