|
|
|
| Industry Paper |
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages.
MacDermid Alpha Electronics Solutions
|
|
Complete the form below to download this technical paper.
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|