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The Next Step in Surface Prep!
All-new Ontos Clean Atmospheric Plasma System. Create pristine, atomically-controlled, activated surfaces without a vacuum chamber.
Ontos Equipment Systems
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| Industry Paper |
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study.
TeraView
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The Essential Guide to BGA Reballing
What makes BGA reballing reliable and repeatable? This technical guide covers deballing, ball alignment, solder alloy conversion, inspection, and other considerations for high-reliability applications.
Circuit Technology Center
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