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New Quadra Pro Manual X-Ray System
Sets a new standard for high-resolution 3D/2D manual inspection with exceptional image clarity and reduced noise levels Learn more.
Nordson TEST & INSPECTION
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| Industry Paper |
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs.
Amkor Technology, Inc.
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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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