Sponsor

Advanced Packaging: Flexible Die Bonder
The MRSI-705 die bonder's versatile work area handles many input and output types. Scan the QR code for an augmented reality experience!
MRSI Mycronic

Industry Paper

Eliminating Interfacial Delamination in High-Power Automotive Devices

This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology.

Amkor Technology, Inc.

Complete the form below to download this technical paper.

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science