Sponsor

Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science

Industry Paper

The Economics of Electronic Component Salvage and Reuse

This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips.

Circuit Technology Center Inc.

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Sponsor

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS