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High-volume Manufacturing
The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations.
Surfx Technologies
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| Industry Paper |
Reducing CTE Mismatch Defects in Flip Chip Reflow
TrueFlat technology uses negative pressure reflow and Advanced Thermal Control (ATC) to reduce warpage, micro spikes, and CTE mismatch defects in ultra-miniaturized electronic assemblies with fragile ELK materials.
BTU International, Inc.
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Accurate Corner Fill Inspection SQ3000™
Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications.
Nordson Test & Inspection
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