semiconductor
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Sponsor
StratEdge Corporation
StratEdge Opens New Facility
StratEdge moved its headquarters and operations to an expanded Poway, California facility, boosting capacity for molded and post-fired ceramic packages. The ITAR-registered, ISO 9001:2015-certified site includes cleanroom areas for production.
StratEdge Corporation
Epoxy Bonding With Stamping
Industry Paper

Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield

Lead frame packages are commonly used in semiconductor package fabrication, where interconnections between the integrated circuits (IC) and the metal leads are typically established through die attach and wire bonding processes.
ZESTRON Corporation
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DL Technology
Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology