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New Quadra Pro Manual X-Ray System
Sets a new standard for high-resolution 3D/2D manual inspection with exceptional image clarity and reduced noise levels Learn more.
Nordson TEST & INSPECTION
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| Industry Paper |
A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC (Multilayer Ceramic Chip Capacitor) capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech Technologies
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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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