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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology

Industry Paper

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation

Mass reflow (MR) processes face challenges with package warpage and solder joint quality in fine-pitch devices. Laser-assisted bonding (LAB) offers precise, localized heating, enhancing soldering quality and reducing warpage.

Amkor Technology, Inc.

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Sponsor

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science