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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology

Industry Paper

Incorporating EOTPR in Chip-Level Failure Analysis Workflow: Case Studies

The paper showcases six failure analysis case studies comparing TeraView’s Electro Optical Terahertz Time Reflectometry (EOTPR) with other electrical fault isolation techniques. It highlights EOTPR's ability to isolate faults in advanced IC packaging such as CoWoS.

TeraView

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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science