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Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science

Industry Paper

Detecting Wafer Level Cu Pillar Defects Using 3D X-ray Microscopy (XRM) with Submicron Resolution

Two case studies show how advanced high-resolution 3D XRM can detect and visualize defects in Wafer Level Chip Scale Packages (WLCSP) containing RDL and Cu pillar microbumps.

ZEISS

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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS