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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation

Industry Paper

US Microelectronics Packaging Ecosystem: Challenges and Opportunities

Analyzing The U.S. Advanced Packaging Ecosystem With Countermeasures To Mitigate Hardware Security Issues by strengthening domestic advanced packaging capabilities.

University of Florida, Herbert Wertheim College of Engineering

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Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis