Sponsor

Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology

Industry Paper

A versatile stepper tool designed to address the challenges of diverse device processes

This paper highlights several unique features of the stepper tool. Not only its satisfactory resolution and competitive throughput, the "PPS-8000" series demonstrates a strong capability for handling diverse device processes.

ORC Manufacturing CO., LTD

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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science