Sponsor

Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology

Industry Paper

Custom Substrates Enable Fast-Turn Package, Assembly Development

Chip designers can leverage custom substrates to quickly develop optimal packaging and assembly solutions for high-speed, high-performance devices, overcoming time-to-market challenges.

QP Technologies

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Sponsor

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science