What's Next In Advanced Packaging?
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Summary
Experts in semiconductor engineering highlight breakthroughs in 3D-ICs, photonic & interposer tech. They stress the importance of AI, metrology & thermal-mechanical simulation. Despite thermal hurdles, chiplet ecosystems & industry collaboration are accelerating 3D-IC adoption.
Semiconductor Engineering
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The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
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