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TSMC Evolves CoWoS Technology, to Challenge 9x Reticle Sizes in 2027
Summary
TSMC revealed at the OIP Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, featuring a 9x reticle size and supporting 12 HBM4 stacks, revolutionizing AI and HPC chip performance.
Digitimes
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The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
