Chip Industry Week In Review
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Summary
Samsung unveiled its latest 2nm and 4nm process nodes and AI solutions at the Samsung Foundry Forum. The company outlined an aggressive roadmap, including 3D-ICs with logic-on-logic in 2025, custom HBM, backside power delivery, and co-packaged optics.
Semiconductor Engineering
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The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
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